2 resourceful techniques to manufacture efficient boards

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Whether it is our house or office, electronic gadgets has become an insuperable part of our lives. We all are entirely dependent on them for our day-to-day needs. Wondering, what makes these gadgets readily usable? Well, answer to this is printed circuit board assembly. To prepare the board, basic two types of methods are used, which are explained below- Through hole technology The foremost method, which came into picture for manufacturing of circuit boards, was through-hole technology. Components, which are to be used in the electronic device, are drilled through the panel. After drilling, components are soldered on to the board and the gear gets ready to be used. The stages involved in through hole assembly are: • Components are first selected and cropped • After cropping of components is done, they are soldered into the board • In order to make the bond strong, molten solder is applied between the circuit board and component termination • The left over flux residues is then removed from the board Surface Mount Technology This method came into existence in the 1980’s and became very popular within no time because it was a wonderful alternative to the previously manufactured boards that were high on cost and low on efficiency. This made engineers look out for a more appropriate and better option that could create electronic board sat a cost effective method. Unlike through-hole method, in this method components are soldered directly on to the circuit boards. Besides this factor, another aspect that made SMT technology so popular is its cost effectiveness that allows manufacturer to prepare the board at a much cheaper price than that prepared by through-hole method. Moreover, size and weight of the board is almost is ¼ to 1/10 unlike to the boards prepared through previous methods. The stages in surface mount assembly are- • First, solder paste is applied to the board. • Components are then placed into the solder paste. • Heat is applied so that components are held tight with the board. • At last, cleaning is performed to remove flux residues. Apart from these two aforementioned methods, various other methods have come into existence like box build or electro mechanical assembly methods, which are effective in creating boards that needs to have cable harness, moulded plastics, wire harness and looms.